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    分立器件
    分立器件
    Discrete Device

    Y4132PA(2SA1837)-1.0 小信号通用三极管

    ★  Y4132PA是利用硅外延工艺生产的PNP型小功率中压三极管芯片

    ★ 圆片尺寸:5英寸

    ★ 利用该芯片封装的三极管典型成品有2SA1837

    ★ Y4132PA与Y4132NA构成互补对管

    ★ ICM = -1A,PCM = 20W(TO-126),-55-150℃

    ★ 芯片尺寸:1.32X 1.32(mm)2

    ★ 压焊区尺寸   B区压焊尺寸:300×330(μm)2

                    E区压焊尺寸:330×330(μm) 2

    ★ 正面电极:铝,厚度4.5μm

    ★ 芯片背极:背银

       芯片背极为集电极,基极与发射极的键合点位置见右图

    ★ 芯片厚度:240±10(μm)

    ★ 划片道宽度:60μm